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Wafer-level packaging
Results: 24

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11	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:01:57 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
12	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 16:24:43 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
13	FlipChip International: I MPLEMENTING TO SUPPORT GROWTH, OBTAIN REAL TIME COMMUNICATION AND RAPID PROBLEM SOLVING An AssurX interview with Sheila Mosher, VP of Information Technology Introduction Add to Reading List Source URL: www.assurx.com Language: English - Date: 2014-08-06 22:09:12 Quality management system Electronics Electronic engineering Semiconductor device fabrication Electronics manufacturing Technology Wafer-level packaging Chip scale package Flip chip Quality assurance
14	JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 3, JUNE[removed]Wafer-Level Packaging Based on Uniquely Orienting Self-Assembly (The DUO-SPASS Processes) Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2006-11-13 22:12:11 Technology Wafer Etching Deep reactive-ion etching Microelectromechanical systems Three-dimensional integrated circuit Thermal oxidation Photolithography LIGA Materials science Microtechnology Semiconductor device fabrication
15	Hermetic Wafer-Level Packaging development for RF MEMS switch C. Ferrandon1, F. Greco1, E. Lagoutte1, P. Descours1, G. Enyedy1, M. Pellat1, C. Gillot1, P. Rey1, D. Mercier1, M. Cueff1, X. Baillin1, F. Perruchot1, N. Sil Add to Reading List Source URL: www-leti.cea.fr Language: English* - Date: 2011-12-19 03:46:29 Semiconductor device fabrication Electronics manufacturing RF MEMS Microtechnology Microelectromechanical systems Wafer Hermetic seal Solder Switch Technology Materials science Electronics
16	1 Assembly and Packaging Difficult Challenges Difficult Challenges[removed]Summary of Issues Add to Reading List Source URL: public.itrs.net Language: English - Date: 2014-03-31 09:28:23 Microtechnology Wafer Back end of line Microelectromechanical systems Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array Semiconductor device fabrication Electronics Technology
17	Microsoft PowerPoint - Chang-Chien_WLP presentation[removed]v1.ppt Add to Reading List Source URL: www.kiss.caltech.edu Language: English - Date: 2008-07-23 18:43:06 Electronic engineering Electronics manufacturing Integrated circuits Wafer-level packaging Monolithic microwave integrated circuit Semiconductors Wafer Gallium arsenide High electron mobility transistor Electronics Technology Semiconductor device fabrication
18	1 Assembly and Packaging Difficult Challenges Difficult Challenges[removed]Summary of Issues Add to Reading List Source URL: www.itrs.net Language: English - Date: 2014-03-31 09:28:23 Microtechnology Wafer Back end of line Microelectromechanical systems Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array Semiconductor device fabrication Electronics Technology
19	MICROSYSTEM INTEGRATION AND PACKAGING Advanced Interconnect and Packaging Technologies RTI International is home to one of the premier wafer bumping and wafer-level packaging research and fabrication facilities in the U Add to Reading List Source URL: www.rti.org Language: English - Date: 2014-10-29 13:23:56 Materials science Flip chip Wafer-level packaging Chip scale package Microelectromechanical systems Solder RTI International Reliability Wafer Semiconductor device fabrication Electronics Technology
20	65th ECTC Call for Papers First Call For Papers IEEE 65th Electronic Components and Technology Conference www.ectc.net To be held May 26 - May 29, 2015 Add to Reading List Source URL: www.ectc.net Language: English - Date: 2014-07-17 15:59:18 Semiconductor device fabrication Semiconductors Electronic design Electronics manufacturing RF MEMS Wafer-level packaging Microelectromechanical systems Reliability Flip chip Technology Electronics Electromagnetism

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